PCB Design & Layout
Multi-layer board design, impedance control, signal and power integrity, EMI/EMC-driven placement. Production-ready output including Gerber, BOM and Pick&Place.
Available for new projects
Electronic hardware design and R&D engineering
Concept, schematic, multi-layer PCB, prototype and test — I run the entire hardware development chain myself. From STM32-based control boards to power electronics, sensor fusion and high-speed digital design.
7+
years of engineering experience
3
completed R&D projects
2–6
layer PCB stack-ups
8
hardware modules designed
Expertise
The whole hardware chain, one owner
I take the chain from schematic to manufacturing files end to end, so the design decisions that usually get lost between separate vendors stay with one responsible engineer.
Embedded Control Systems
STM32 and ARM Cortex-M based control boards, sensor integration, CAN / RS-485 / Modbus communication layers and hardware-software integration.
Power Electronics
SMPS topologies (Flyback, Buck-Boost, LLC), motor driver stages, high-current routing, thermal balancing and hardware-level protection circuits.
R&D & Project Consulting
Technical feasibility, concept development, test protocols and documentation. Experience writing and running projects under TÜBİTAK 1512 and KOSGEB R&D programmes.
Selected work
Hardware modules
The modules below are prototypes designed, manufactured and tested as part of R&D work.
PTM-01 — Power Train Module
Power-train monitoring module with current and voltage measurement, MOSFET driver stages and hardware-level protection. Measurement data is reported to the main controller over CAN.
Katman / Layers2
Gerilim / Voltage35 V
Akım / Current20 A sürekli · 30 A tepe
Boyut / Size120 × 250 mm
MCUSTM32 F serisi
BMS-01 — Battery Management System
Battery management board with cell monitoring, passive balancing and protection layers. Overcharge, temperature and short-circuit protection are handled at hardware level.
Katman / Layers2
Gerilim / Voltage35 V
Akım / Current20 A sürekli · 30 A tepe
Boyut / Size120 × 120 mm
MCUSTM32 F serisi
High-Speed Processing Board — BCM2712 + DDR4
Multi-layer processing board based on the Broadcom BCM2712 SoC and DDR4 memory, designed for high-bandwidth applications. Impedance and length matching on the DDR topology, a layered power-distribution network and signal-integrity verification were the design priorities.
Katman / Layers6
Boyut / Size100 × 120 mm
İşlemci / SoCBroadcom BCM2712
Bellek / MemoryDDR4
Standart / StandardJEDEC JESD79-4
How I work
From analysis to manufacturing files
01
Analysis
Clarifying requirements, constraints and target cost
02
Proposal
Scope, schedule and cost agreed in writing
03
Design
Schematic, component selection and multi-layer layout
04
Prototype
Manufacturing files, sourcing and first article assembly
05
Test
Measurement, failure analysis and design verification
06
Revision
Corrections from findings and a production-ready release
Have a hardware idea?
Let's talk through the scope and technical constraints — I'll come back with a clear picture of the steps and the time it takes.